| Technology Roadmap 技术路线 | |||||
|---|---|---|---|---|---|
| inch [mm] |
标准 2018 |
先进 2018 |
新兴 2018-2019 |
未来 2020 |
|
| 关键属性 | 层数 | Up to 16L | 18L to 28L | 30L 到 36L | 40+L |
| 最小/最大厚度 | 012” [.30]/.125" [3.2] | .008" [.20]/.200" [5.08] | .006” [.15]/.250" [6.35] | TBD/≥.300" [7.62] | |
| 最大 pnl 尺寸 | 18x24[457x610] | 24x30 [610 x 762] | 24x42 [610 x 1067] | 待定 | |
| 最小线宽线距（铜厚） | 内层 | .004" [.10] 1 | .003" [.076] H | .002" [.05] 5um | <.002" [.05] Qoz |
| 外层 | .004" [.10] T | .003" [.076] Q | .002" [.05] 5um | <.002" [.05] Qoz | |
| 公差 | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.006] | ±.0002" [.005] | |
| 机械孔大小 | 钻咀 | .008" [.20] | .006" [.15] | .006" [.15] | .006" [.15] |
| 孔pad直径 | +.008" [.20] | +.008" [.20] | +.006" [.15] | .006" [.15] | |
| 厚径比 | 10:1 | 20:1 | 25:1 | 30:01:00 | |
| Base copper weights: 1=1oz H=1/2 OZ, T=3/8 OZ, Q=1/4 OZ | |||||
| 孔结构 | 镭射孔层 | 1+N+1 | 2+N+2 | 3+N+3 | ELIC |
| 埋孔 | Yes | Yes | Yes | Yes | |
| 叠孔 | Stacked on Sub | Yes | Yes | Yes | |
| 镭射孔 | 最小孔 | .004" [.10] | .004" [.01] | .003" [.76] | .002" [.05] |
| 孔pad直径 | +.008" [.20] | +.006" [.15] | +.004" [.10] | +.003" [.076] | |
| 厚径比 | 0.8:1 | 1:1 | 1:1 | 1:1 | |
| 导通&非导通填孔 | 最小孔径 | .008" [.20] | .008" [.20] | .006" [.15] | <.006" [.15] |
| 厚径比 | 12:1 | 18:1 | 26:1 | 30:1 | |
| 阻焊 | 对位 | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| 最小开窗 | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| 最小绿油桥 | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |
| 表面处理 | ENIG, OSP | ENEPIG | Thick Gold Multiple Finishes | 待定 | |
| Im Sn, Im Ag | Wire Bondable Gold | ||||
| LF HASL | Multiple Finishes | ||||
| Hard Gold Body | |||||
| 物料选择 | Rogers 3000/4000 | Ultra Low Loss Dk/Df |
埋线 埋元件 |
||
| Halogen Free FR4 EMC 828, EMC 888K | I-Tera® I-Speed® EMC 891K | Tachyon 100G® MetroWave | |||
| Buried Capacitance | Polyimid, Megtron 6N | Megtron 7N, EMC 890K | |||
| 408 HR Nelco-13s | Hybrid PCBs | Thermal Management PCBs | |||
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